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End-Of-Life (EOL) of the U3280M-NFBY-18/NFBG3Y-18
EOL for Part NumberATR0610-PQQ-43
EOL of the ATA5567xxx Part Numbers
EOL T5554xx Part Numbers
2374 End of Life Product
885062-A End of Life Notice
885071-A End of Life Notice
885216 End of Life Obsolescence
Add AIC Malaysia as a Second Source for RF Tag Products Assembly a. Test Location; AT88RF416-MSA
Add AIC Malaysia as a Second Source for RF Tag Products Assembly and Test Location; AT88RF319
Add Amkor as alternate source for wafer bumping
Adding alternate source for wafer bumping
Addition of a SOT-89 Assembly CM
Addition of a SOT-89 Assembly CM
Addition of a SOT-89 Assembly CM
Addition of a SOT-89 Assembly CM
Addition of SOT-89 Assembly CM
Addition of SOT-89 Assembly CM
AG606-G EOL & MSL Mis-Classification
Alternate Assembly, Test, T&R
Alternate Assembly, Test, T&R Site
Alternate Bump, Test and DPS Sites
Alternate Foundry
Alternate Foundry and Laminate
Alternate Foundry for QM56028 and QM56030 GaAs Die
Alternate Foundry Notification
Alternate Foundry Notification
Alternate GaAs Fab
Alternate Laminate Substrate Supplier (Revised)
Alternate source for wafer bumping
Alternate source for wafer bumping
Alternate source for wafer bumping
APBU End of Life
APBU End of Life (QM77038 QM78041 QM78143)
Assembly Site Move
ATA5773-PXQW Wafer Fab Transfer to Atmel Colorado Springs and EOL of the TSG Product Version
ATA5774-PXQW Wafer FabTransfer to Atmel Colorado Springs and EOL of the TSG Product Version
ATR4252-RAQW Wafer FabTransfer to Atmel Colorado Springs
Automotive End of Life Notice on Legacy Products
Automotive End Of Life Notice on Legacy Products
BAW filter die update
Broadband – EOL of Low Volume Products
CCB 3762 Final Notice: Qualification of MMT as an additional assembly site for ATA5291x device family available in 48L VQFN (7x7x1mm) package.
CCB 3762 Final Notice: Qualification of MMT as an additional assembly site for ATA5291x device family available in 48L VQFN (7x7x1mm) package.
Change Die Orientation on Sticky Tape of ATA5577M2330C-DBN
Change of Assembly and Test site – QPD0005
Change to CM,Die attach, mold compound & MSL
Change to Die attach, mold compound & MSL
CMD169/CMD169P4 Datasheet Correction
CMD170P4 Max Supply Current Typo Correction
CMD293 Design Change
CMD302C4 EOL Notification
CMD319C3 Datasheet Correction
CMD328K3 Datasheet Spec Change
CMOS Die Transfer to Alternate Foundry
Country of Origin Update for WLCSP
Country of Origin Update for WLCSP (QM81050)
CryptoRF New Silicon Revision
CryptoRF New Silicon Revision
CryptoRF New Silicon Revision
CryptoRF New Silicon Revision and Changed MR1 Package
CryptoRF New Silicon Revision and Changed MR1 Package
Die Attach Epoxy Change
Die attach epoxy change for TQP7M9105
Die number revision
Die number revision
Die number revisions
Die number revisions
Die number revisions
Die number revisions
DSBU EOL products
DSBU EOL products
DSBU: End of Life QM28001/QM22450A
End of Life – Multiple Products
End of life 885067
End of Life for CMD314
End of Life for GaN Power Amplifier
End of Life for RFFM8211 and RFFM8511
End of Life Notification
End of Life Notification
End of Life Notification
End of Life Notification
End of Life Notification
End of Life Notification
End of Life notification
End of Life Notification
End of Life Notification (QPQ1281)
End of Life Notification (TQQ7301)
End of life notification for 885026
End of Life notification for QPA5389A & QPA7489A
End of Life Notification for RFUV1703
End of Life Notification for SBB1089Z
End of Life notification for TQL9042
End of Life Notification for Various BAW Filters
End of Life Notification for Various GaN HEMTs
End of Life notification of TQC9305
End of Life Notification QPF7806Q
End of Life Product
End of Life Product
End of Life Product – QPQ2455
End of Life Product – QPQ2456
End of Life Products
End of Life Products
End of Life QM22547
End of life SPF5189Z, SPF5122Z
End of life TQQ1030
End of Life: QM13011, QM13112A, QM13132, QM13136
End Of Life: QM26001
End Of Life: QM26001
End-Of-Life (EOL) of the AT88SCxxxxCRF CryptoRF Devices
End-Of-Life (EOL) of the ATA5577M1330C-UFPW
End-Of-Life (EOL) of the RFID IDIC (Identification Integrated Circuit) e5561A-DOW
EOL – QPB2318/28 & QPB3311
EOL – QPB7420/QPB7425 (Broadband)
EOL – TAT7427BT1
EOL AT88CK109STK3 Development Kit
EOL AT88RF04C & AT88SC0xxxxxxxCryptoRF Family of Secure RFID Devices
EOL AT88SA10xx-TH-TCyptoAuthentication Products
EOL ATA542x ASK/FSK Transceiver 315MHz and its Associated Development Kits
EOL ATA55581x Part Numbers
EOL ATA6838 & ATA6839 1A Hex Half-bridge Driver IC
EOL ATR0891 Devices &Associated Evaluation Kit
EOL ATR2820 and ATR7040 & All Associated Development Kit
EOL ATR4256 and ATR4258 Devices
EOL CMD171P4
EOL CMD217 CMD262
EOL CryptoRF Package Option MVB1G for the AT88RFxxx and AT88SCxxxxCRF Devices
EOL for theATA3741Px, ATA3742Px, ATA5743Px, ATA5744N, T5743P6 Products Manufactured by TSG
EOL Notification
EOL Notification (Revised LTB and LTS dates)
EOL Notification (Revised)
EOL Notification for Gain blocks
EOL Notification for QPF4010, QPL2210 and QPL2210D
EOL Notification TGF2934, TGF2942 and TGF2956
EOL of Low-Volume BBD Products
EOL of QM58101A
EOL of RF5210
EOL of RF5228B
EOL of RF7182
EOL of RF7193, RF7196, RF7196D, RF7198, RF7198D
EOL of RF7248
EOL of RF7411
EOL of RF7412
EOL of RF7849
EOL of RF9822
EOL of RFA Products
EOL of RFID Products in DBN Packaging
EOL of the T5557xx Part Numbers
EOL of TQF6260
EOL of TQF6297H
EOL QPA1000, QPA1001, QPA1014
EOL QPA2229D QPA2210D
EOL TGA2594/2595/2597/2599
EOL TGA2813-CP
EOL TGA2958-SM
EOL TGA4036
EOL TGA4544-SM
EOL U2102B Devices
EOL U2270B-MFPG3 83 Leaded Part
EOL U2790B Devices
EOL: 885075
EOL: Exiting a Bump House and a Fab
EOL: QM22246
EOL: QM22248, QM23002, QM23007, QM23141
EOL: QM22545
EOL: QM25005A, TQQ1003, TQQ0041T
EOL: QM77058B and QM77058E
EOL: TQM963014
EOLAT88RF04C & AT88SC0xxxxxxx CryptoRF Family of Secure RFID Devices
EOLATA5505_ATA557001C_T2270B_U2270B Products Manufactured by TSG
Epoxy Manufacturing Location Change
Epoxy Manufacturing Location Change
Epoxy Manufacturing Location Change & MSL Update
Epoxy MFG Location Change
Fab Process Obsolescence
Fabrication site of I2C CMOS controller die change
Filter End of Life Notification
Filter part marking change
Filter product EOL
GaAs 4-inch to 6-inch Wafer Conversion
GaAs 4-inch to 6-inch Wafer Conversion
GP565NGB End of Life
GP565NJC End of Life
IDP MSL Reclassification
Implementation of the BOD Feature in the ATA5771/73/74
Introduce Alternate Cover Tape Supplier C-PAK
Introduction of UMC Fab 8 as 2nd Source Wafer Supply for New Generation RF Products
Introduction of UMC Fab 8 as 2nd Source Wafer Supply for New Generation RF Products
LCP Lid tooling change
Legacy GaAs EOL Notification
Lid Material Change
Lid Material Change
Long Term Obsolescence
Long term Obsolescence 2025
Low Volume Products Obsolescence
LTS Date Extension for CMDxxxx products
Marking Change Notification
Module Lead Frame Material Change for AT88SC102-09ET-00
Mold compound change notification
Mold compound change notification
MSL rating reclassification for TGS2353-2-SM
Multiple DLA products End of Life
Multiple DLA products End of Life
New and additional Test & Finishing line for ST25R3916 and ST25R3917
New Sawing and Packaging Location of ATA556711N-DDT
Obsolescence of GaAs pHEMTs
Process Change Notification for QPD1009
Product End of Life RF6590, RF8115, QM57518
Product EOL Notification
Product EOL Notification
Product EOL Notification
Product EOL Notification
Product EOL Notification (CMD279)
Product EOL: RF2815, RF2818
Product Labeling Change Notification
Product Marking Font change
Product Transfer to Next Generation Fab Process
QM11022A End of Life
QM11023 End of Life
QM11024A End of Life
QM11044A enhanced Trigger Function
QM11124 End of Life
QM11133 Alternate Foundry Site
QM11558 End of Life
QM12102H End of Life
QM12154 End of Life
QM13021 End of Life
QM13114 End of Life
QM13119 End of Life
QM13124C, QM12114, and QM13341 add DZ assembly
QM13141 End of Life
QM13144 end of Life
QM13145 and QM13146 End of Life
QM13324 End of Life
QM14501 End of Life
QM14510 – Substrate Change
QM17001 EOL
QM22450 End of Life Notice
QM23003 End of Life
QM23341: Alternate Assembly Site
QM26001: Alternate Assembly Site and Processes
QM28005/QM28012 EOL
QM33120W test platform/location addition
QM48859 EOL
QM58101Y Qorvo External Fab Polyimide Change
QM75005 EOL
QM77002 Product EOL
QM77040, QM77040A, QM77040B, QM77040E Obsolescence
QM77048B/D/E Branding Change
QM77058D Filter Design Improvement
QM78208-QM78208B-QM78208E EOL
QM78209- East Fishkill Fab EOL
QM78210/QM78218 Controller Design Change
Qorvo Die Attach Epoxy Supplier Change
Qorvo Fab Processes EOL – WiFi
Qorvo Legacy Y Parts Obsolescence
Qorvo SOT89 -MSL & ESD Notification
QPA4586A Datasheet Update
QPA6489A and AG604-89G EOL Notification
QPB7464 End of Life Notice
QPB9319 End of Life
QPB9320 End of Life
QPC1220Q Ext Fab Site and Laminate Supplier Change
QPC2040 mold compound change
QPC3624 – EOL (Low Volume)
QPD0305 Datasheet Correction
QPD1000 End of Life Notification
QPD1004, QPD1011, QPD1014 End of Life Notification
QPD1017, QPD1018, QPD1019 End of Life Notification
QPD1425, QPD1425L End of Life Notification
QPD9300 End of Life Notification
QPF5010 family, LNA die to 6-inch process
QPF5010, QPF5005, QPF5002 mold compound change
QPF5420Q Obsolescence Notice
QPF5602Q 2nd Source (Silicon & Bump House)
QPL1815 – Epi & Die Attach Epoxy Change
QPL1817 Product Obsolescence
QPL1818 – MSL Update
QPL6220Q EPI Reactor Change
QPQ1029 End of Life notification
QPQ1214 Datasheet Correction
QPQ1270 and QPQ1288 End of Life notification
QPQ1270 wafer conversion & Mold compound change
QPQ1288 Attenuation Spec Change
QPQ1297 wafer conversion
QPQ6108 laminate change
Restore TGA4509 to production status
Revised Filter End of Life Notification
RF1126 End of Life
RF1492Y IPD Supply Change
RF1498Y IPD Supply Change
RF1602 RF1633, and RF1147 End of Life
RF1614A End of Life
RF1638 End of Life Notice
RF1654A End of Life
RF1657 Alternate Assembly Site
RF1674A End of Life
RF1804 End of Life
RF1891 End of Life
RF1895 End of Life
RF1896 End of Life
RF5212 End of Life
RF5228 End of Life
RF5565 End of Life
RF6261W End of Life
RF6261Y – End of Life
RF6261Z – End of Life
RFCA1008 – EOL
RFCA8828 – Test Location Change
RFCA8830 – Die Probe Optimization
RFFM4227 – End of Life
RFFM4293 End of Life
RFFM8228P End of Life
RFLA1038 End of Life Notification
RFLA9002 & RFLA9003 EOL Notice
RFPA1005, RFPA2005 EOL Notice
RFPA5512 End of Life
RFPA5532 – End of Life
RFPA5542 End of Life
RFPA5542B End of Life
RFPA5562 End of Life Product
RFSW8001 End of Life
SC-2072-BP End of Life
SOT-89 Manufacturing Robustness Improvement
SOT-89 MSL Update (HPA-BBD)
SOT89 manufacturing robustness improvement
SOT89 manufacturing robustness improvement
SOT89 MSL Update (HPA-BTS)
Spatium Gen 1.0 Products End of Life Notification
Std prod die changed from waffle pack to gel pack
SXA389Z End of Life Notification
SZA5044Z End of life
T2G4005528-FS 4-in to 6-inch Wafer Conversion
T2G6003028-FL Second Source Package Introduction
T2G6003028-FS Second Source Package Introduction
Tape Size change for multiple parts
TAT6254C – Fab Process Change
TAT6254C – Marking Change
TAT7460B1A Product Obsolescence
TAT7461 – Fab Process Change
TAT8804D1H – Epi Manufacturing Location Change
Test Location Site change
Test Site Addition
TGA2307 / TGA2307-SM die mask change
TGA2565-SM End of Life
TGA2624-CP End of Life
TGA4046 EOL
TGA4826-SM End of Life PCN
TGA4957-SM End of Life
TGF2819-FS Change to 3MIG2
TGF3020-SM Change to 3MIG2
TGF3020-SM: Die attach material change
TGL2201-SM datasheet limit change
TGS2355-SM Lid Material Change
TQL9044 EOL notice
TQM2M9016 End of Life Notice
TQM7M5013 End of Life
TQM879006A, TQM879008 EOL Notice
TQM879026 end of life
TQM8M9075, TQM8M9077 EOL
TQM8M9079 EOL
TQQ0041E End of Life
TQQ1007 End of Life
Transfer of RFID Transponder Production
Update on Power Down Current in the VIF Pin (Pin 6)
Various ACS Parts End of Life
Wafer Fab Transfer to Atmel Colorado Spring for the ATA5724P3-TKQY 19
Addition of a SOT-89 Assembly CM
Addition of Assembly & Test Site
Addition of Assembly and Test Site for QPA9442
Alternate Bump House
Assembly & Test Site Addition – QPC4270
Automotive Second Source Bump House
AWMF-0146/AWMF-0147 Test Location Change
CMD192 datasheet update
CMD192C5 datasheet update
CMD319C3 datasheet updates
Datasheet Correction
End of Life Notification for QPA4586A
End of Life Notification of AS3990-BQFT
End of Life Notification
End of Life R13MP
EOL – QM23441/QM28024
EOL of Broadband Optical Receivers
EOL of Broadband SOT-89 Products
GP712KXBG – End of Life
Laminate Supplier Change
Leadframe Manufacturer Change – RFSA3043
Leadframe Manufacturer Change for TQP9113
Leadframe Manufacturer Change
Leadframe Manufacturer Change
Leadframe Manufacturer Change
Lid Attach Epoxy Change
New Source Bump House
Package Changes
QM12102 Laminate Supplier Change
QM42391TR13 alternate fab
QM57508 – End of Life
QM77048D End of Life
Qorvo Laminate Supplier Change
Qorvo New EPI Supplier in Oregon Wafer Fab
Qorvo New EPI Supplier in Oregon Wafer Fab
Qorvo New EPI Supplier in Oregon Wafer Fab
QPA1724 ESD CDM Rating Update
QPB1029 Package Height Change
QPF7612Q End of Life
Qualify New EPI Supplier for Qorvo’s fab process
RF1492Y End of Life Notice
RF1648A End of Life Notice
Site Changes
Substrate Supplier Change
TAT7472A1F – EOL
Test Site Addition
TGF2965-SM Marking Change