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Contact
News
Newsletter subscription
Manufacturer News
Events
Company
About Ineltek
Subsidiaries and Contact Information
Certificates
Careers
Code of Conduct
Careers
Product Matrix
Linecard
Manufacturers
Product Matrix
Semiconductors
Power, Timing & Passive Components
Displays, Accessories & Optoelectronics
Products
Overview Total
Overview Semiconductors
Overview Memory
Overview Sensors
Overview Power, Timing & Passive Components
Overview Displays, Accessories & Optoelectronics
Product Highlights
Service
EOL & PCN
Our Service
Contact Form
Request for Quotation
Technical Support
Programming Service
Logistics and Warehouse
RoHS & REACH
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CCB 4345 Final Notice: Qualification of MTAI as a new assembly site for selected Supertex products available in 16L QFN (4x4mm) package.
CCB 4540 Initial Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8900NC die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.
CCB 4541 Final Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.
CCB 4542 Initial Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8900NC die attach and gold (Au) bond wire material assembled at MMT assembly site.
Data Sheet – MIC4421A/4422A Data Sheet Document Revision
Qualification of EFTEC-64T lead-frame for selected products in 8L VDFN package at NSEB assembly site
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the B2M2 Process Technology
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