Ineltek Crypto Archive • Ineltek

Design-In-Expertise And Service

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6.1mm 28-TSSOP Discontinued

ATSHA204 Copper (CU) Bond Wire Change

Data Sheet – ATTPM20P Trusted Platform Module (TPM) 2.0 – SPI Interface Summary Data Sheet

End of Life (EOL) Notice of ATECC608A-TNGAxxx, ATECC608A-TNGLxxx and ATECC608A-TFLXxxx-Proto device families

End of Life (EOL) of CryptoAuthentication Kit

End-Of-Life (EOL) of the CryptoAuthentication Evaluation Kits

End-Of-Life (EOL) of the CryptoAuthenticationXplained Evaluation Kits

Introduction of new ATECC608B Trust device Family available in 8L UDFN and 8L SOIC packages as replacement to an existing ATECC608A Trust device family that are currently available in 8L UDFN and 8L SOIC packages

Migration of ECC108 to ECC108A

Migration of SHA204 to SHA204A

Migration of SHA204 to SHA204A

Qualification of ATP assembly site for AT88RF1354-ZU and AT88RF1354-ZU-T catalog part numbers (CPN) available in 36L VQFN package.

Qualification of ATP assembly site for AT97SC3204 device family available in40L MLF (or VQFN) package.

Upgrade of Cryptoauthentication Kits

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