Winbond – Continued focus on DDR2/DDR3 DRAM: Winbond covers the areas of research and development, product design and wafer production (2 x 12” fabs) in-house.
With extensive experience in the domain of integrated memory and logic circuits, the company covers a wide range of memory products.
For Winbond, in-house manufacturing expertise and its own fabs are the decisive advantage in providing long-term storage solutions for applications that require long life cycles.
Winbond lists its DRAM products in the Customized Memory Solutions (CMS) segment. This may initially seem surprising in view of JEDEC-compatible DRAMs. However, with this positioning Winbond emphasizes the extensive integration possibilities of its own RAM products.
These include the CUBE interface technology for an extremely high bandwidth connection and the option for 2.5D/3D integration with high-end SoCs. The ultra-low power HYPERRAM products (alternative for PSRAM), which enable extremely space-saving solutions, can also be found here.
Winbond divides its DRAM range into Speciality DRAM (SDR and DDR) and Mobile DRAM (LPSDR / LPDDR). Winbond currently offers over 2250 different derivatives. To help you find your way through this variety, our graphic shows the product naming depending on the technology. As the LPSDR/LPDDR are basically part of the respective main family, we have added further digits in the product designation accordingly.
At this point we would like to highlight the DDR2 and DDR3 products. Why?
As has been known for some time, manufacturers such as Samsung, SK Hynix or Micron (and others) are preparing to phase out older technologies – especially DDR3 – in order to free up capacity for HBM memory (HPC applications such as AI) and DDR5 (PC & server). This reduces the availability for many applications in the automotive, industrial or medical sectors.
However, Winbond continues to offer a stable supply of memory ICs with the W97x (LP)DDR2 and W63x (LP)DDR3 DRAM products. A complete overview can be found in the current Product Selection Guide (CMS PSG) on pages 18 to 20 and pages 34 to 46.
The broad (LP)DDR3 range with approx. 850 derivatives offers a suitable and future-proof selection for many applications!
Winbond – DDR2/DDR3 DRAM memory is the solution for a secure supply for your application beyond 2025. Do not wait until the discontinuations take effect, approve W97x or W63x memories for your products now. Contact us directly or send us your inquiry here – we will get in touch with you immediately