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ASR86xx Series
Burn In Product Transfer
CCB 4031 Final Notice: Qualification of Microchip Technology Tempe – Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.
CCB 4214.001 Final Notice: Qualification of MMT as a new assembly site for selected MSCC LX3302Axxx and LX34050xxx device families available in 14L TSSOP (4.4mm) package.
CCB 4440 Final Notice: Qualification of MMT as an additional assembly site for selected MTCH112, MTCH810 and PIC12xxxx device families available in 8L DFN (3x3x0.9mm) package.
CCB 4506 Initial Notice: Qualification of MMT as an additional assembly site for selected products available in 8L TDFN (2x3x0.8mm) package.
CCB 4506 Initial Notice: Qualification of MMT as an additional assembly site for selected products available in 8L TDFN (2x3x0.8mm) package.
CCB 4507 Initial Notice: Qualification of MMT as an additional assembly site for selected products of MCP9844T and MCP98244T device family available in 8L TDFN (2x3x0.8mm ) package.
CCB 4508 Initial Notice: Qualification of NSEB as a new assembly site for selected ATTINY20, ATTINY40, AT42QT2120, AT42QT1070, AT42QT1050 device families available in 20L VQFN (3x3x0.85mm) package.
CCB 4509 Initial Notice: Qualification of NSEB as a new assembly site for selected ATTINY2xx, ATTINY44x, ATTINY84x and AT42QT1040 device families available in 20L VQFN (3X3X0.85mm) package
CCB 4541 Final Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.
change notification for ENS210 datasheet
Change of final device test location to the current assembly house and consequently the final product label
Change of production site
Change to absolute maximum ratings and NTC functionality in the CCS811
Change to firmware application version to manage consistency of the eCO2 / TVOC readings during initial device operation and extend the output range
CMV2000 Test diode pads unbonding
CMV4000 Test diode pads unbonding
Data Sheet – EMC1812/EMC1813/EMC1814/EMC1815/EMC1833 Data Sheet Data Sheet Document Revision
Data Sheet – MGC3140 3D Tracking and Gesture Controller Data Sheet
Data Sheet – MIC281 – Low-Cost Thermal Sensor Datasheet Document Revision
Data Sheet – MIC284 – Two-Zone Thermal Supervisor Datasheet Document Revision
Data Sheet – MIC384 – Three-Zone Thermal Supervisor Datasheet Document Revision
Data Sheet – RE46C181 – CMOS Programmable Ionization Smoke Detector ASIC with Interconnect, Timer Mode and Alarm Memory
Data Sheet – RE46C201 – 9V Programmable Photoelectric Smoke Detector ASIC
Data Sheet Change for TCS3430
End of Life (EOL) of EMC118xx
End of Life Notification of RFD77XXX
EoL notificaation (TSL45315CL)
EoL notification
EoL notification (AS3606, AS3607, AS3608, AS3658)
EoL notification (TMD2671_TMD2771)
EoL notification (TMD37821/TMD37823)
EoL notification (TSL250R, TSL260R, TSL251R, TSL257SM, TSL261R, TSL261RD, TSL252R)
EoL notification TMD37003
EOL of AS7000-AB
EOL of AS73210 / MMCS6
EOL of BMA222, BMA250, BMA222E, BMA250E, BMA255
EOL of BMC150 and BMC156
EOL of BMG160
eSign# E000034719: End of Life (EOL) of SSC7102, SSC7150 and MM7150 device families
Exchange of Pretreatment Chemistry to a cyanide free zincation and improvement of aluminum etch
Filter Equipment Change for TSL2584TSV
Glass cover tape
IMU M-G370PDF0/M-G365PDx0 Design Change Information
MAJOR — Punch (Singulation) MLF Assembly Site Transfer
Minor updates to the CCS811 datasheet
NanEye2D Supply Chain update
NanEye2D Supply Chain update
OL and Replacement of the AT30TS75 Digital Temperature Sensor with the New AT30TS74 and AT30TS75
Product Discontinuation Notice BMC050 digital, eCompass
Product Discontinuation Notice BMC056 digital, eCompass
Qualification of Microchip Technology Tempe – Fab2 (TMGR) as an additional fabrication site for selected Atmel products
Qualification of MMT as an additional Assembly site for selected products available in 16L (3x3x0.5mm), 16L (4x4x0.5mm), 20L (4x4x0.5mm) and 28L (4x4x0.5mm) packages
Second site for backend final testing
Terminal plating (Sn-Bi to Pure-Sn) and Saw type of QFN
Test Location Move and Test Platform Transfer for ENS210-LQFM
CCB 4440 Final Notice: Qualification of MMT as an additional assembly site for selected MTCH112, MTCH810 and PIC12xxxx device families available in 8L DFN (3x3x0.9mm) package.
EOL and Replacement of the AT30TS750 Digital Temperature Sensor with the New
EOL and Replacement of the AT30TSE752, AT30TSE754 and AT30TSE758
EOL of BMP180
MAJOR — Punch (Singulation) MLF Assembly Site Transfer
Transition from Non BSP to BSP For DF-8805
Xsense Shipment : Full Line Conversion from 6” ABS Cushion to 6” Hard Cores