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8-Mbit Serial Flash (AT25DF081, 1.65V to 1.95V) Process Geometry Shrink and Discontinue 11-Ball
Addition of the X-FAB (Malaysia) Wafer Fabrication Facility for all AT45DB041D Products
AT25F512A Die and Design Shrink
AT26DF161 Die and Design Shrink
Atmel Sale of Serial FlashProduct Family to Adesto Technologies
EOL of Leaded Package Offerings for Memory Devices AT29
EOL of the AT26DF081A, 8Mbit Serial Flash
EOLof the AT49BV160D(T) and AT49BV163D(T) Parallel Flash Device
EOLof the AT49BV160D(T) and AT49BV163D(T) Parallel Flash Device
051A_EOL_AT25SF081
052A_EOL_AT25SF161
16-Mbit DataFlash® (AT45DB161D) Process G eometry Shrink and Device Enhancement
16-Mbit DataFlash® (AT45DB161D) Process Geometry Shrink and Device Enhancement – REVISED
16-Mbit DataFlash® (AT45DB161E) Wafer Manufacturing Plant Addition
16-Mbit Serial Flash(AT25DF161) Process Geometry Shrink and Device Enhancement
2-Mbit DataFlash® (AT45DB0 21D) Process Geometry Shrink and Device Enhancement
2-Mbit DataFlash® (AT45DB021D) Process Geometry Shrink and Device Enhancement
2-Mbit DataFlash® (AT45DB021D) Process Geometry Shrink and Device Enhancement – REVISED
2-Mbit DataFlash® (AT45DB021E) – Yield Improvement
32-Mbit DataFlash® (AT45DB321D) Process Geometry Shrink and Device Enhancement
32-Mbit DataFlash® (AT45DB321D) Process Geometry Shrink and Device Enhancement
32Mbit Serial Flash AT25DQ321 End of Life
4-Mbit DataFlash® (AT45DB041D) Process Geometry Shrink and Device Enhancement
4-Mbit DataFlash® (AT45DB041D) Process Geometry Shrink and Device Enhancement
4Mbit Serial Flash AT25DF041A End of Life
4Mbit Serial Flash AT25DF041A End of Life
512kbit Serial Flash (AT25F512B and AT25BCM512B) Process Geometry Shrink and Device Enhancement
64-Mbit DataFlash® (AT45DB642D) Process Geometry Shrink, Design Change and Device Enhancement
64-Mbit DataFlash® (AT45DB642D) Process Geometry Shrink, Design Change and Device Enhancement
64Mbit Serial Flash AT25DF641 End of Life
8-Mbit DataFlash® (AT45DB081D) Process Geometry Shrink and Device Enhancement
8-Mbit DataFlash® (AT45DB081D) Process Geometry Shrink and Device Enhancement
8-Mbit DataFlash® (AT45DB081D) Process Geometry Shrink and Device Enhancement
A29xxx series. 5V 1M/4M/8M/16Mbits NOR Flash
Addition of ASE, Shanghai for Serial Flash 8L SOIC 150 mil Package Assembly and Test; AT25,AT45
Addition of the UMC (Taiwan) Wafer Fabrication Facility for all AT25DF321A Products
Addition of the X-FAB (Malaysia) Wafer Fab Facility for all AT45DB011D Products
Addition of the X-FAB (Malaysia) Wafer Fabrication Facility for All AT25F512B Products
Addition of the X-FAB (Malaysia) Wafer Fabrication Facility for all AT45DB011D Products
Adesto® Products – Wafer Probe Test Site
Adesto® Serial Flash & DataFlash® Products Package Marking Change
AT25F2048 Die and Design Shrink
AT25F512A Die and Design Shrink
AT26DF081A End-of-Life (EOL) Notice
AT26DF161A Design Shrink
AT26DF321 and AT25DF321 Migration to 110nm Process Node
Burn In Product Transfer
Capacity Expansion for the .150″ Narrow SOIC Package
Capacity Expansion for the .150″ Narrow SOIC Package and .208″ Wide SOIC Package
Change AssemblySubcontractor for the U2044B-MFPY and U2044B-MFPG3Y
Change of Packing Labels and Reel Size for Espressif Chip Products
End-of-Life for the AT25DF021Devices
End-of-Life for the AT25DQ161Devices
End-Of-Life for the AT49F1024A and AT49LV1024A Parallel Flash
End-Of-Life of A29L008/A29L008A Series
EOL AT25FS010 Product Family
EOL AT45DCB002D, AT45DCB004D & AT45DCB008D DataFlash Card Device
EOL AT49BV040B, AT49BV80D, AT49SV163D, AT49SV322D Parallel Flash
EOL AT49BV040B, AT49BV80D, AT49SV163D, AT49SV322D Parallel Flash
EOL of all Wafer and package Options of AT25SF041
EOL of the AT49BV160S & AT49BV160ST Parallel Secure Flash Device
EOL of the Parallel Flash produce line with AT29 and AT49
EOL of W764M32V-XSBX; D500xxx
EOL of W764M32V-XSBX; D500xxx
Flash and DAF Change for ESP8285N08 and ESP8285H08
Fremont Micro Devices Exits Serial Flash Business
Gold Wire Diameter Reduction for Serial Flash, AT25, AT26, AT45
Gold Wire Diameter Reduction for Serial Flash, AT25, AT26, AT45
Manufacturing Capacity Expansion for the 8-contact, 6 x 8mm, Very Thin Dual Flat No Lead Package (VDFN)
N76E003AT20
nd-Of-Life (EOL) of the ATSAM3S-EK Evaluation Kit
New Carrier Tape for 16 SOIC (0.300″ wide) Package, AT25DF, AT26DF
One layer mask Change for production test yield improvement; 16Mbit DataFlash Products AT45DB161E and AT45DQ161
One layer mask Change for production test yield improvemtn; 32Mbit DataFlash Products AT45DB321E and AT45DQ321
PCN (Product change notice) 70ns to 55ns change
Product Change Notification of MX25L1025C
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 0.25um TSMC wafer technology
Replacement Products for theAT32UC3A0 and AT32UC3A1 Product Family
Spansion S29AL008D die revision change to S29AL008J die
W72M64VB-XBX End of Life
W764M32V-XSBX, D50010 and D50031 die EOL notification
Wafer Process Technology Change
Wafer Process Technology Change
(DE) 64-Mbit DataFlash® (AT45DB641E) Wafer Manufacturing Plant Addition
Adding a new assembly vendor– OSE, located in Kaohsiung, Taiwan, for 63CSP (9x11x1.0 mm)
AT45DB011D End of Life
Discontinuance of MX25V4035
Discontinuance of MX25V8035
Discontinuance of MX29GL512E H/L
Discontinuance of MX29LV040CT2I-70G
PCI for SCR200 products
Sumitomo compound EME-G700 change for LINGSEN TSOP48
UMC 8D Wafer Fabrication Facility for All AT45DB321E Product
(DE) W25Q32RV “R-Series” (58nm) to replace W25Q32JV “J-Series” (58nm) 32Mb 3.3V SpiFlash® Memories industrial products
(DE) W25Q40RL “R-Series” (58nm) to replace W25Q40CL and W25X40CL “C-Series” (90nm) 4Mb 3.3V SpiFlash® Memories industrial products
(DE) W25Q80RL/RV “R-Series” (58nm) to replace W25Q80DL/DV “D-Series” (90nm) 8Mb 3.3V SpiFlash® Memories industrial products