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32-Kbit SPI interfaceAutomotive Grade Serial EEPROM (AT25320A) Process Geometric Shrink andDevi
32-Kbit SPI interfaceAutomotive Grade Serial EEPROM (AT25320A) Process Geometric Shrink andDevi
32-Kbit Two-wire interfaceAutomotive Grade Serial EEPROM (AT24C32A) Process Geometric Shrink an
AT24C32D & AT24C64D Introduction of New Serial EEPROMs with an Operating Range of 1.7V to 5.5V
AT25128A, AT25256A Die Shrink & Remove PDIP Package Offering
AT88SCxxyyC CryptoMemory Optimized Layout in PDIP & SOIC
End-of-Life of the Parallel EEPROM (28 Series) Product Line AT28
EOL of Industrial Grade Parallel EEPROM (28 Series) Products AT28
EOL of SELECTIVE Industrial Grade Parallel EEPROM (AT28)
1-Kbit & 2-Kbit Two-wire Interface Industrial Temp Grade Serial EEPROM Process Geometry Shrink a
1-Kbit SPI interfaceAutomotive Grade Serial EEPROM (AT25010A) Product Layout Optimization andDev
1-Kbit/2-Kbit 2-wire interface Automotive Grade (-40C to +125C) Serial EEPROM (AT24C01B/AT24C02B
128-Kbit SPI interfaceAutomotive Grade Serial EEPROM (AT25128A) Process Geometric Shrink & Devic
128-Kbit Two-wire InterfaceAutomotive Grade Serial EEPROM (AT24C128) Process Geometric Shrink &
16-Kbit SPI interface Automotive Grade Serial EEPROM (AT25160A) Process Geometric Shrink and De
16-Kbit Two-wire interface Automotive Grade Serial EEPROM (AT24C16A) Process Geometric Shrink an
2-Kbit SPI interface Automotive Grade Serial EEPROM (AT25020A) Product Layout Optimization and D
2-Kbit SPI interfaceAutomotive Grade Serial EEPROM (AT25020A) Product Layout Optimization andDev
2-Kbit Two-wire Interface Industrial Temperature Grade (-40C to 85C) Serial EEPROM (AT24C02C)
2-Kbit Two-wire Interface Industrial Temperature Grade (-40C to 85C) Serial EEPROM (AT24C02C)
2-Kbit Two-wire Interface Industrial Temperature Grade (-40C to 85C) Serial EEPROM (AT24C02C)
2-Kbit Two-wire Interface Industrial Temperature Grade (-40C to 85C) Serial EEPROM (AT34C02C) Pr
256-Kbit SPI interfaceAutomotive Grade Serial EEPROM (AT25256A) Process Geometric Shrink & Devic
256-Kbit Two-wire interfaceAutomotive Grade Serial EEPROM (AT24C256) Process Geometric Shrink &
4-Kbit 3-wireInterface Automotive Grade Serial EEPROM (AT93C56A/ AT93C66A) ProcessGeometric Shri
4-Kbit SPI interfaceAutomotive Grade Serial EEPROM (AT25040A) Product Layout Optimization andDev
4-Kbit/8-Kbit 2-wire interface Automotive Grade (-40C to +125C) Serial EEPROM (AT24C04B/ AT24C08
44-LCC Package Discontinuation in Military 1Mb Parallel EEPROM Product Family
4Mb Parallel EEPROM Discontinuation
64-Kbit 2-wire interface Automotive Grade (-40C to +125C) Serial EEPROM (AT24C64A) Process Geome
64-Kbit SPI InterfaceAutomotive Grade Serial EEPROM (AT25640A) Process Geometric Shrink andDevic
8-Kbit SPI interface Automotive Grade Serial EEPROM (AT25080A) Process Geometric Shrink and Devi
Add ASE Shanghai, China for Industrial Grade Serial EE 8ld JEDEC TSSOP Package; AT24C
AT24C01B and AT24HC02B Serial EEPROM Process Geometry Shrink and Device Enhancement
AT24C01C to AT24C01D — 1-Kbit I2C-Compatible (Two Wire Interface) Industrial Temperature
AT24C04C to AT24C04D — 4-Kbit I2C-Compatible (Two Wire Interface) Industrial Temperature
AT24C04C to AT24C04D — 4-Kbit I2C-Compatible (Two Wire Interface) Industrial Temperature
AT24C08C to AT24C08D — 8-Kbit I2C-Compatible (Two Wire Interface) Industrial Temperature
AT24C08C to AT24C08D — 8-Kbit I2C-Compatible (Two Wire Interface) Industrial Temperature
AT24C1024B Industrial Temp Grade Serial EEPROM Layout Optimization and Device Enhancement
AT24C16C to AT24C16D — 16-Kbit I2C-Compatible (Two Wire Interface) Industrial Temperature Grade (-40°C to 85°C) Serial EEPROM Process Optimization and Device Enhancement
AT24C256B OPTIMIZED LAYOUT AND LOW-VOLTAGE
AT24C32D & AT24C64D Introduction of New 1.7V 32K and 64K Serial EEPROMs
AT24C32D to AT24C32E — 32-Kbit I2C-Compatible (Two Wire Interface) Industrial Temperature Grade (-40°C to 85°C) Serial EEPROM Process Optimization and Device Enhancement (Continued Support of 5V 1-Kbit Two-Wire Interface Industrial Temperature Grade (-40 to 85C) EEPROM device (AT24C32D))
AT25010A, AT25020A and AT25040A DIE SHRINK
AT25010A, AT25020A and AT25040A Optimized Layout
AT25080A and AT25160A Die Shrink
AT25080A and AT25160A Die Shrink
AT25080A and AT25160A DIE SHRINK
AT25080A and AT25160A Die Shrink & Remove PDIP Package Offering
AT25080A, AT25160A Die Shrink & Remove PDIP Package Offering
AT25128A and AT25256A Die Shrink
AT25320A and AT25640A Die Shrink
AT34C02C EOL Notification (Automotive) Serial EEPROM
AT34C02C EOL Notification (Automotive) Serial EEPROM
AT88SCxxyyC CryptoMemory Optimized Layout in PDIP & SOIC Packages
AT93C46 Automotive Product Layout Optimization & Conversion
Cancellation Notice: EOL of AT28 Series Parallel EEPROM (256k and 1Mb) Military grade devices in the CerDIP packages only.
CryptoRF LV Capacitor Breakdown Fix, AT88SC
End-Of-Life (EOL) of the EEPROM AT28x CerDIP Packages
End-Of-Life (EOL) of the EEPROM AT28x CerDIP Packages
EOL Notice on the use of SL370 with the 1Mbit 28 Series industrial grade device (AT28C010E-2EM).
EOL notification of WEDC part number WPF512K32-XXX
EOL of RM24xx, RM25xx and RM3xxx SPI & I²C EEPROM devices
EOL of the AT28C040-20BI Sidebraze DIP Device
FT24C02A-Kxx and FT24C04A-Kxx Serial EEPROM Family – Process Conversion
FT24CxxA-Exx Serial EEPROM Family – Process Conversion- Order Code Change
Industrial Temp Grade Serial EEPROM (AT34C02C) Process Geometry Shrink & Device Enhancement
Inked wafer mark to Inkless wafers for Serial EEPROM AT24C/93C
Inkless Wafers for CryptoMemories and CryptoRF Device, AT88SC
INTRODUCTION OF A NEW 1.7V 2K SERIAL EEPROM; AT24C02B
Introduction of New Three-Wire 2K-bit and 4K-bit Industrial Temperature Grade (-40°C to +85°C)
Introduction of New Two-Wire 4K-bit and 8K-bit Industrial Temperature Grade (-40°C to +85°C)
Introduction of New Two-Wire 4K-bit and 8K-bit Industrial Temperature Grade (-40°C to +85°C)
Migrating AT17LVxxx and AT17Nxxx to ROHS Compliant Fully Green Configurator Package
Module Lead Frame Change Used for Smart Card Modules for the Secure Memory Family, AT88SC
Module Lead Frame Material Change Used for Smart Card Modules for the Crypto Memory, AT88SC
MWE128K8-XCX Dynamic Supply Current Change
New CryptoMemory Wafer Stepping Pattern, AT88SC
Qualification of MMT for Assembly and Final Test for all Military EEPROM Products available in Hermetic packages
Qualification of palladium coated copper with Gold Flash bond wire in selected products of the 150K and 160K wafer technologies
Replacement for Military AT28C010E Devices (Speed Grades 20ns and 25ns)
Replacement for Military AT28C256F Devices (Speed Grades 20ns and 25ns)
Test Operation Location Change for Mil-Std-883, AT28C, AT28HC
Transfer of 6 and 7 mil Backgrind OperationsAT24/25/29/88; ATD88
Transfer of Parallel EEPROM AT28 Products
Addition of a 15,000 Unit/Reel Ordering Option for the UDFN Package for all Serial
AT24C01C to AT24C01D — 1-Kbit I2C-Compatible (Two Wire Interface) Industrial Temperature
AT24C16C to AT24C16D — 16-Kbit I2C-Compatible (Two Wire Interface) Industrial Temperature
AT24C16C to AT24C16D — 16-Kbit I2C-Compatible (Two Wire Interface) Industrial Temperature
Qualification of top marking, assembly and final test site at MTAI as an additional site for selected AT24Cxx device family available in 5L SOT-23 package.
Serial EEPROM Copper (Cu) Bond Wire Change
Update of the Datasheets regarding pureRXMode
Update of the Datasheets regarding pureRXMode