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News Fornitori
Eventi
Azienda
About
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Certificati
Carriera
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Carriera
Product Matrix
Linecard
Produttori
Product Matrix
Semiconduttori
Potenza, Temporizzazion, Passivi
Displays, Accessori & Optoelettronica
Prodotti
Panoramica complessiva
Panoramica semiconduttori
Panoramica memorie
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Panoramica display
In Evidenza
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2DID Branding Change
Add Alternative 8 MB Flash Source for ESP32 Series of Modules
Add Alternative 8MB/16 MB Flash Source for ESP32 Series of Modules
Assembly Site Change
BOM Change for ESP32-C3-WROOM-02U
BOM Change for Several ESP8685-Based Modules
CCB 4108 Final Notice: Qualification of DEI6 as a new assembly site for selected ATML ATWILC3000 and ATWINC3400 device families available in 36L Module package.
CCB 4245 Final Notice: Qualification of MMT as an additional assembly site for selected Atmel ATA57xx, ATA58xx, ATA82xx and ATA85xx device families available in 32L VQFN (5x5x1mm) package using palladium coated copper with gold flash (CuPdAu) bond wire
CCB 4578 Final Notice: Standardization of Pin 1 Orientation in Tape and Reel packing media for selected ATSAMCxxExx and ATSAMRxxExx devices families available in 32L VFQN (5x5x1 mm) package.
Change Embedded Flash Material on ESP32-C3FN4,ESP32-S2FN4R2,ESP32-S2FH4 and Related Module/ Develop Board Products
Change for ESP32-WROOM-32, ESP32-WROVER, ESP32-WROVER-I, and ESP-WROOM-02 modules
Change to Die attach, mold compound & MSL
Change to Die attach, mold compound & MSL
Data Sheet – ATWINC3400 IEEE 802.11 b/g/n Network Controller Module with Integrated Bluetooth
Data Sheet – MRF24J40 Data Sheet Document Revision
Data Sheet – PIC32MZ1025W104 MCU and WFI32E01 Module with Wi-Fi® and Hardware-based Security Accelerator Data Sheet
Data Sheet – WLR089U0 Low Power LoRa® Sub-GHz Module Data Sheet Data Sheet Document Revision
Datasheet Correction for MSL Rating
Delete Common AT Firmware on ESP32-C3 Series Modules from Manufacture Line
End of Life for QPA2576N
End of Life for TQF7059, SWA5001Z
End of Life Notification for GaN Power Amplifiers.
End of Life Notification for RF2054
End of Life Notification SIM7100A
End of Life Products
End of Life Products
End of Life Products
EOL of RF7415
EOL of RF7940
EOL of RF8020
EOL of RF8028
EOL of TQP6M9002
EOL of TQP6M9002
ERRATA – PIC32MZ-W1 MCU and WFI32E01 Module Errata
eSign# E000032153: End of Life (EOL) of selected RN-240xxx and RN-270xxx device families.
ESP32-D2WD Product Obsolescence Notice – Last Time Buy
ESP8285H08 Product Obsolescence Notice
Espressif common AT firmware is not flashed to ESP32 series of modules (8MB/16MB flash) by default from the manufacturing line
Espressif Common AT Firmware is not Flashed to ESP32-S2 & ESP8266 (16MB flash) Series of Modules by Default from the Manufacturing Line
Espressif Module MPN Upgrade
GaAs 4-inch to 6-inch Wafer Conversion
Introduce XM25QE32CHIGT08H as alternative 4 MB flash source to Espressif ESP32 Series Products
Introduction New Embedded Flash Material on ESP32-C3FH4, ESP8685H4 and Related Module Products
Introduction of FM25Q128A-SOB-T-G as Alternative 16 MB Flash Source to Espressif ESP32 Series Module Product
Introduction of GD25Q32ETIG as alternative 4MB flash source for ESP8266 Series of Modules
Introduction of GD25Q64ESIG as an alternative 8 MB flash source of Espressif ESP32 Modules
Introduction XM25QH64CKIQB08S as Second Source Flash on ESP32-PICO-V3-02
Minor Change – customer information
Qorvo Die Attach Epoxy Supplier Change
Qorvo Die Attach Epoxy Supplier Change
QPA4971D End of Life
Qualification of DEI6 as a new assembly site for selected ATML ATSAMR21B18 and ATSAMR21G18 device families available in 9L and 48L Module package.
Release and Introduction of AT Firmware V2.2.0.0 into ESP32-MINI-1 & ESP32-MINI-1U Modules
Release ESP32-C3-MINI-1 module Default Common AT firmware V2.4.2.0
Remove Hall Sensor from ESP32 Series of Documentation
RF1656 and RF1658 Additional Assembly Supplier
RF3183I EOL Notification
RF3235 Product EOL
RF7907 Package Dimension Correction
RFDA0047 EOL Notice
Security Advisory for USB_OTG & USB_Serial_JTAG Download Functions of ESP32-S3 Series Products
Shield Cover Marking Change for ESP Modules
Shield Cover Marking Change for ESP32-C3-MINI-1 Modules
Shield Cover Marking Change for ESP32-S3 Series Modules
Shield Cover Marking Change for Espressif Modules
SIM 7020 G changes PA
SIM7500E add alternative PAs
SIM7500E-L1C add alternative PAs
SIM7500SA add alternative PA
SIM7600E add alternative PAs
SIM7600E-H1C add alternative baseband chip & PAs
SIM7600E-H1CD add alternative baseband chip & PAs
SIM7600E-L1C add alternative PAs
SIM7600JC-H add alternative baseband chip & PAs
The IS1621S, IS1657Sx, IS168xx, IS169xxx, BM21AVD01NB1, BM57SPPxxx, BM81SPKxxx and BM91SPKA5NB7 device families will be moving to End of Life (EOL) status effective today.
The PCB EPAD Vias are Changed to be Double-sided Plugged for ESP32-WROVER-E/IE
TQC9312 End of Life
Update ESP32 ESP32 (4MB flash) series modules AT firmware version to V2.1.0.0
Updating the PCB boards of ESP8266 & ESP32 series
Upgrade Manufacturer Part Number and Laser Marking of Espressif Module
(DE) Add Alternative 16 MB Flash Source for ESP32-S3 Series of Modules
(DE) Add Alternative 4 MB Flash Source for ESP32 Series of Modules
(DE) Add Alternative 8 MB Flash Source for ESP32-S3 Series of Modules
(DE) Add Alternative Flash Source for ESP32-C3, C6, S3 Series Modules
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