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Addition of the X-FAB (Malaysia) Wafer Fabrication Facility for All AT45DB321D Products
AT91SAM7S256 MRL B Revision and Ordering Code Change
End-Of-Life (EOL) of the ATA6623/25/27_U4091_ATMEGAHV1
EOL for ATR4257, U4257BM,T4260 AM/FM Frontend for Car Radio
EOL NOTIFICATION OF LFOUNDRY PRODUCTS – REVISED –
EOL of ATR2732N Integrated DAB One-Chip Frontend
for theATR0621P1_ATR0622P_ATR0601 GPS Automotive Products
for theATR0621P1_ATR0622P_ATR0601 GPS Automotive Products
LFoundry Rousset EOL Notice
29C516E 16-Bit Flow-Through EDAC Error Detection and Correction unit
Add JCET as 2nd source of some PPM products
Add JCET as 2nd source of some PPM products
Add Product Code for QM11022U and QM12630
Add TSMC (Taiwan) Wafer Fabrication Facility, AT91R40008, AT91RM9200 and AT91SAM9260 Products
Amplifier End of Life Notification
Assembly Location and Lead-Free Material Changes for CryptoMemory AT88SCxxyyC-SU / AT88SCxxxyyCA
AT7908E CAN Controller for Space Application
AT83C21GC144 Product Termination
AT90SCR100 Product Termination
AT91SAM7S128 MRL B Revision and Ordering Code Change
AT91SAM7S512 MRL B Revision and Ordering Code Change, Adding UMC Manufacturing Location
AT91SAM7S64 MRLB Revision, Ordering Code and Manufacturing Location Change
ATA5811*, ATA5812* Wafer FabTransfer to Atmel Colorado Springs and EOL of the TSG Product Versio
ATA6824-MFHW Wafer FabTransfer to Atmel Colorado Springs and EOL of the TSG Product Version
ATA6826-TUQY Add CSO Wafer Fab
ATA6833_ATA6834 Wafer FabTransfer to Atmel Colorado Springs
ATMXT224 Firmware Revision Change from V1.6 to V2.0
ATR0610-PQQ Change of Assembly Location Due to Thailand Flood
ATR0610-PQQ Change ofAssembly Location Due to Thailand Flood
ATR1841-P1QW – Datasheet Updated After Product Characterization
ATR4251_ATR4253 Wafer FabTransfer to Colorado Springs
ATSHA204 UDFN (MAH) Assembly/Test Second Source
Battery Holder NH5077-LF
Battery Holder NL5077-LF
Build up a new 2nd assembly source site in Korea (STS) forTSOP48 6304 & 6305 products
Burn-in time reduction 8H->4H
CCB 2695.009 Final Notice: Qualification of ANAC as an additional assembly site for selected KSZ9131RNXxx and KSZ9031RNXxx device families available in 48L VQFN (7x7x0.9 mm) package.
CCB 4159 Final Notice: Implement Microchip Part Aging Policy, Recertification and Combination rules, Labels and Packing Changes for selected Microsemi Field Programmable Gate Array (FPGA) and Mixed Signal and ASIC(MSA) products
CCB 4442.001 Initial Notice: Qualification of G631HQ mold compound material for Atmel AT8USDX6CDR-RUTU and AT8UA1184AE5-RUTU catalog part numbers (CPN) available in 144L LQFP (20x20x1.4mm) package.
CCB 4510 Final Notice: Implement Microchip Part Aging Policy, Tape and Reel Combination rules, Label and Packing Changes for selected Microsemi High Reliability Discrete Solutions (HRDS) products
CCB 4532 Final Notice: Implement Microchip Top marking changes for selected Microsemi Field-Programmable Gate Arrays (FPGAs) products available in various packages.
CCB 4534 Final Notice: Implement Microchip marking changes for selected Microsemi MSA products available in various packages.
Change from Au bonding wires to Cu bonding wires
Change from Au bonding wires to Cu bonding wires
Change in the marking ofATPL210A-A1U-Y and ATPL220A-A1U-Y
Change Notice for Add Assembly Subcontractor -ASEKS (Assembly vendor code: K) for SOP8 (209mil)
Change of Assembly factory for QFP (Quat Flat Package)
Change of Bill of Material
change of bill of material for QFN
Change of Country of Origin For CR1216 MFR and CR1220 MFR naked cells
Change of Cover Tape Material from KOSTAT to ADVANTEK HUC for Use on 8mm Carrier
Change of SDTR1503 to SDTR1103
Change to Atmel TSPIC/Philippines for the U3280M-NFBY / U3280M-NFBG3Y in SSO16 Package
Change UDFN Reel Quantity from 5K to 15K
Conversion to Cu Wire for SmartFusion, IGLOO2, and SmartFusion2
Conversion to RoHS-Compliant Fully Green Package for the TSSIO16E-TIRA
Convert Rating for 8 Lead SOIC from MSL2 to MSL1,AT25,AT26,AT45
Convert MSL3 to MSL1 for QFN Packages
Convert MSL3 to MSL1 for QFN Packages
Convert MSL3 to MSL1 for QFN Packages
Convert MSL3 to MSL1 for QFN Packages
Copper-Wire Bonding for QFN packages for AS3606x-BQFT / AS3607x-BQFT
Data Sheet – MCP1811A/11B/12A/12B Family Data Sheet
Data Sheet – RE46C191 Data Sheet
Datasheet Update for AT90PWM216 – AT90PWM316
Deprecated WD_TIMEOUT Port to the Fabric
Discontinuation of Legacy Paid IP Cores
DSBU Product EOL – 885032
DSBU Product EOL – QM22249/QM23040T/QM17001C
Encapsulation Material Change
End of Life
End of Life (EOL) of KSZ8873MLLJ Micrel catalog part number (CPN).
End of Life (EOL) of MSCC VSC7414XKT-01, VSC7416XKT-01, and VSC7418XKT-01 catalog part numbers (CPN).
End of Life Announcement for CR2450HT 3V Lithium Coin cells
End of Life CXE2089Z & RF3827
End of Life Notification for Various BAW Filters
End of Life Notification for Various BAW Filters
End-Of-Life (EOL) of the ATPL21xxx
End-Of-Life (EOL) of the ATPL220A-A1U-Y and ATPL220BN-99
End-Of-Life (EOL) of the ATSAM4SP32A-ANU-Y and ATSAM4SP32AEK-99
End-Of-Life (EOL) of the CME6005_ATAR092L_ATAR892S Products
End-of-Life for RFA Products
End-of-Life for the ATA557001 Part Numbers
End-of-Life for the ATA5577M333x Part Numbers
End-Of-Life for the ATA5577Mxxxx Part Numbers
End-of-life for the ATA6871Devices and Associated Design Kit
End-Of-Life for the ATR1841-P1QW Product
End-Of-Life notification
End-of-Life of Five AVR STK500 Add-on Modules
EOL (End-of-Life) Notification of MDV5524URH
EOL 32L & 44L TQFP Package for the AT17Fxx Family
EOL ams AS35xx
EOL ams AS3647B / AS3648B
EOL AT42QT4160-MU andATQT16C01-ASG
EOL AT73C506 Products
EOL AT88SA-ADK1 Crypto Authentication USB Dongle Demonstration Kit
EOL AT97SC3203S-X9K20 TPM Demonstration Kit
EOL AT97SC3204-X1DB150 TPM Demonstration Kit
EOL ATR2731 DAB One-chip Frontend
EOL Dual Triple Driver T6819, ATA6829, ATA6831, ATA6832
EOL DVD Products, T0806, T0816, T0816M, T0820, ATR0826
EOL Flasher with Trailer Control ATA2069-3ASY (DIP8)
EOL for ATR4262M1-PLQW and ATR4262M3-PLQW
EOL for the AT88CK44REDCryptoAuthentication USB Dongle Demo Kit
EOL forB10011S, T6801, U4793B, U479B, ,U6032B, U6430B, U643B2, U6803B, U6815BM
EOL notice of products with built-in AKM-IC
EoL notification (NX16 platform – various products)
EoL notification – AS1320/AS1321/AS1325
EOL notification / EP9221- EP9421 – EP9213 – EP9331
EOL of ACT4751QI101
EOL of ACT8600QJ
EOL of AT73C240C
EOL of ATR2740 DAB Digital Processing Device
EOL of EPF011C-T/S, EP9321, EP9331, EPF001A
EOL of INGT165BG and INGR165BG
EOL of ING_TRF
EOL of MB15, MB37, MB40, MB54, MB86, MB87, MB89
EOL of PDIP24 and PDIP20 packages; AS110PL/PE, AS1106PL/PE, AS1107PL, AS1108PL
EOL of PPM products
EOL of PPM products
EOL of QM45858
EOL of the AT73C213 and AT73C213B
EOL of the ATR0849-PFQG Products
EOL of the Industrial(Non-Automotive) Devices from TSG Wafer Fab
EOL of U6808B Special Fail-safe IC
EOL on various Active-Semi devices
EOL Pre-Notification
EOL RFDA0057, RFDA0015, RDA1005L
EOL Triple Half Bridge Drivers ATA6828, T6818
Epson discontinuation of long time no order parts Feb-2018
eSign # E000037940: End of Life (EOL) of U4083B-MFPG3Y-19 Atmel catalog part number (CPN).
eSign # E000038680: End of Life (EOL) of CMFCLGF50X60CTAMF-AS and CMFCLGL100X120CBTAMF-AS catalog part numbers (CPN).
ESP8285 Flash Die Attach Film (DAF) Material Change
Espressif Chip Product Cover Tape Material Change
Filter Equipment Change for AS7000-AA
Flash Part Number Change for ESP8266, EPS32, ESP32-S2 Modules Series
For shipment in tape & reel, the tape material will be changed
FY2018 EOL products notice
GaN Process Obsolescence
Gold Bond Wire Diameter Reduction for All 8 bit Microcontroller / AVR / Quantum Research & ASIC
Gold Bond Wire Diameter Reduction for All 8 bit Microcontroller / AVR / Quantum Research & ASIC
I15116FYI EOL notice
Implement additional cover tape, carrier tape and plastic reel material supplier for selected Micrel products available in 3L, 5L, 6L and 8L SOT23, 5L and 6L TSOP and 8L SOIC packages at STAR assembly site
Implement Catalog Part Number (CPN) Changes to Atmel products
Incorporation of ACP Philippines as Additional Probing Location into All PPAP Documents
Introducing environmentally friendly trays for bulk packed silver-oxide batteries > 7.9mm diameter and the CR1025.IB
KYEC – Use of Low Halogen Content HIC (Humidity Indicator Card)
KYEC testing site change from Chu-Nan factory to Tong-Luo factory
LE9551 Data Sheet Document Revision
Libero 12.2 Timing and P&R Changes
Libero SoC Timing Change and IO Glitch Notification
Libero SoC v12.4 Updates for PolarFire, SmartFusion2, and IGLOO2
Lok reel change
LTO LV Capacitor Breakdown Fix, AT88RF319
MCGA Daisy Chains Change
Memo Log # ML0220210001: Implementation of Catalog Part Numbers (CPN) convention changes for selected Microsemi High Reliability Discrete Solutions (HRDS) products including products with cage codes/manufacturer codes 43611/CDWR and SD633/CIRL.
Microchip DPG PDM Non Hermetic Product Supply Chain Update
Microsemi DPG PDM Non Hermetic Product Supply Chain Update
Microsemi Product Discontinuation of Libero USB Dongle Licenses
MSC2X / APT2X Standard Part Number Changes
nd of life Notification – Power Management AT73Cxxx series and AT56H05 / AT56H06
New date code rule for all Zentel products.
New Final Test Location for SmartPower Devices
New Minimum Ordering Quantity (MOQ) Numbers for SmartPower Devices
New Ordering Code for AT90USBKEY Kit
New Wafer Sort Test Facility
New Wafer Sort Test Facility
New Wafer Sort Test Facility
New Wafer Sort Test Facility)
Notice of Discontinuation Feb-2016 incl. STD parts
Notice of Our Supplier’s Improprieties regarding Certification of its Chemical Products, which Integrated into Epson’s Timing Device Products
Obsolescence of 2EZ200D5 – 3EZ200D5 (e3) series of axial-leaded 2.0-3.0 watt Zeners
Obsolescence of GaAs pHEMTs
Packing Change for CQFP 256L Packages KA-KG-KZ
Part number change
PDN of Low Demand Devices
Portfolio rationalization
Pricing Changes on Mature Products
ProASIC3, IGLOO, Fusion, SmartFusion, ProASIC Plus, MX, and AX Family Devices–Change of Mold Compound and Die-Attach Epoxy
Product Change Notification (Glyn/Fujitsu)
Product Change Notification of addition of die source of various commercial devices
Product Discontinuance Notice for the MT9196 Family
Product Discontinuance Notification SMBJ47xxC series (C tolerance)
Product End of Life Notification
Product End of Life Notification
QM13013 End of Life
Qm13124C Branding Change
QM23013 Datasheet Update and Fab Finalization
QM25032 – Add Costa Rica as Assembly Location
QPA2212D Die dimension change
QPA2212D Pad change, bonding change
QPA9122 HBM ESD rating improvement
QPA9419 min Icq change
Qualification of GTK assembly site for selected Supertex products using wafers with Au backside coating available in 3L TO-92 package
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BCD12 Process Technology
Qualification of MTAI assembly site as an additional site for selected Supertex products available in 5L SOT-23 package
Qualification of non-conductive die attach epoxy 8900NC for selected products available in 8L SOIC package at MTAI assembly site
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 150K, 160Kand 250K wafer technologies
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 200K Wafer technology
Qualification of palladium coated copper with Gold Flash bond wire in selected products of the150K and 160K wafer technologies
Qualification of palladium coated copper with Gold flashbond wire in selected products of the120K wafer technology
Replace Military with Extended temperature conditions
RF1119A End of Life
RFPA2026 EOL Notification
RFUV1003 EOL Notification
RT ProASIC®3 Datasheet TID Radiation Performance Update
RTG4 Family Important Changes
RTG4 PLL Lock Stability Customer Notification Second Addendum
RTG4 SET Filter Delay Calibration Update
Silicon revision change from A to B for ATSAMG55G19 device family.
SOI Die Transfer to Alternate Supplier
Solder bump alloy change to all Power PC die
STD items from catalog Product Discontinuance Notice
STD items from catalog Product Discontinuance Notice
Supplemental assembly source for QFP
tape & reel transfer to austriamicrosystems Philippines
Test location and platform change
TGA2575/QPA2575, 4-inch to 6-inch wafer conversion
TGF2929-HM Change to 3MIG2 EG4355
TGF2979-SM Change to 3MIG2 EG4381
The flasher with trailer control ATA2069-TASY (tube) will be discontinued
To change the IC top marking company logo from Winbond to Nuvoton
Topside Laser Marking on Plastic Lead Chip Carrier Packages,AT17
TQP369185 Datasheet Typo Correction
Tray dimension change for plastic QFP-208 and QFP-256
Tray for Holder HU2032-LF
Tray for Holder HU2430-LF
Tray for Holder HU2450N-LF
Tray for Holder SMTU1225-LF
Tray for Holder SMTU1632-LF
Tray for Holder SMTU2032-LF
Tray for Holder SMTU2430-LF
Tray for Holder SMTU2450N-LF
Tray for Renata Holders packed in trays
U4091BM*, T4091R* Wafer Fab Transfer to Atmel Colorado Springs and EOL of the (TSG) Product Vers
Unexpected sudden EOL of LMR2016 rechargeable battery
Updating the Datasheets of the ESP32 Series of Products
VaultIC420 and VaultIC460 product release change
VOL test condition to 10mA on Flash modules
Wafer Fab transfer from Garden Grove to Microchip Fab 2
Wafer Fab Transfer to Atmel Colorado Springs for ATA6286N*. EOL of the Telefunken Semiconductor
Wafer Fab Transfer to Atmel Colorado Springs for ATA6286N*. EOL of the Telefunken Semiconductor
Wafer Fab Transfer to Atmel Colorado Springs for ATA8741*, ATA8742*, ATA8743* and EOL of the TSG
Wafer FabTransfer to Atmel Colorado Springs and EOL of the TSG Product Version
Wafer FabTransfer to Atmel Colorado Springs for ATA8741*, ATA8742*, ATA8743* and EOLof the TSG P
Wafer Foundry Transfer from LFoundry to Alternative Foundry Locations
Wafer Foundry Transfer, 58910(UMC) from 58901(LF) for 86RF231
WJA1500 EOL Notification
ATMXT336S / ATMXT224S FIRMWARE REVISION CHANGE FROM v3.0.AB TO
ATMXT640T FIRMWARE UPDATE FROM v1.5.AA TO v1.6.AA
Capacity Expansion for the UDFN product package
Change of Assembly Location ATA664151
Change of Assembly Location ATA664251
Discontinuation of SL13A (former “SAL”) – to be substituted by AS39513
End-of-Life (EOL) of 90E22PYGI and 90E22PYGI8
(DE) EoL Notification for EasyPoint™ Joystick Module
(DE) EOL of 90E24PYGI8
EOL of 90E24PYGI
EOL of 90E24PYGI
EOL of 90E25PYGI and 90E25PYGI8
EOl of 90E32ASERGI and 90E32ASERGI8
EOL of 90E36AERGI and 90E36AERGI8
(DE) EOL of E2V_568F9_568G6_567C7
(DE) EOL of MXT112S
(DE) EOL of SWF2L23A
EOL of various Active Semi devices
(DE) Installation of improved fab metallization process for 0.35 μm technologies
M90E32AS PCN
MXT1664T3 Firmware v1.1 Release
New Device Variant of 32kB and 64kB Flash versions for Atmel|SMART SAM D21
(DE) PCN INAP375T
Product-Change-Notification of BMA222E
Product-Change-Notification of BMA250E
Qualification of JCAP as Additional Source of WLCSP Assembly and Test
Second source for wafer fabrication
(DE) Substrate Material Change of BGA Products
Tape and Reel Labeling Process Change
Test Location Move and Test Platform Transfer for TSL25715FN, TSL25721FN, TCS37715FN, TCS37717FN, TCS34725FN
Update of ATA6826C
(DE) WLCSP Product Transfer from Flipchip International to DECA Technologies
EOL of Fujitsu