Ineltek Memory Archive • Ineltek

CCB 2927.001 and CCB 3280.002 Final Notice: Qualification of MTAI as an additional assembly and final test site for selected Atmel AT24C0xC, AT24C128C, AT24C16C, AT24C256C, AT24C32D and AT24C64D device families available in 8L SOIC package.

CCB 3363.002 Final Notice: Qualification of UNIS as a new final test site for selected Atmel 24CW64xxx device family available in 4L WLCSP package.

CCB 3379.002 and CCB 3280.001 Final Notice: Qualification of MTAI as an additional assembly and final test site for selected Atmel AT24C0xD, AT24C16D and AT24C32E device families available in 8L SOIC packages.

CCB 3640 Final Notice: Qualification of MTAI as a new final test site for selected Atmel products available in 20L PLCC package.

CCB 4154.001 Final Notice: Qualification of MMT as an additional assembly site for SST25VF080B-50-4C-PAE catalog part number (CPN) available in 8L PDIP package.

CCB 4198.001 Final Notice: Qualification of ASSH as a new assembly site for selected 24xx01, 24xx02, 24xx04, 24xx08 and 24xx16 device families available in 8L TSSOP package.

CCB 4198.002 Final Notice: Qualification of ASSH as a new assembly site for selected 25AA640xx and 25LC640xx device families of 36K wafer technology available in 8L TSSOP package.

CCB 4270 Final Notice: Qualification of GTK as a new assembly site for selected Atmel products available in 28L SOIC (.300in) package.

CCB 4271 Final Notice: Qualification of GTK as a new assembly site for selected AT28BV64Bxx, AT28C64Bxx and AT28HC64Bxx Atmel device families available in 28L SOIC (300mils) package.

CCB 4279.001 Initial Notice: Qualification of GTK as a new assembly site for selected SST38VF640xx, SST39LF40xx and SST39VF40xx device families available in 48L TSOP (12x20mm) package.

CCB 4279.002 Initial Notice: Qualification of GTK as a new assembly site for selected SST39VF3201xx and SST39VF3202xx device families available in 48L TSOP (12x20mm) package.

CCB 4284 Final Notice: Qualification of GTK as a new assembly site for selected SST39VF640xxx and SST39VF320xxx device families available in 48L TSOP (12x20mm) package.

CCB 4284 Initial Notice: Qualification of GTK as a new assembly site for selected SST39VF640xxx and SST39VF320xxx device families available in 48L TSOP (12x20mm) package.

CCB 4397 Final Notice: Qualification of MTAI as a new assembly site for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 8L SOIC (3.90mm) package.

CCB 4404 Initial Notice: Qualification of ASSH as a new assembly site for 24LC512, 24AA512 and 24FC512 device families available in 8L TSSOP package.

CCB 4506 Initial Notice: Qualification of MMT as an additional assembly site for selected products available in 8L TDFN (2x3x0.8mm) package.

CCB 4541 Final Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.

CCB 4547 Initial Notice: Qualification of palladium coated copper (PdCu) bond wire for selected 24AA512, 24FC512 and 24LC512 device families available in 8L TSSOP package assembled at ANAP assembly site

CCB 4556 Initial Notice: Qualification of SIGN as a new assembly site for selected SST39V320xx and SST38VF640xx device families available in 48L TSOP (12x20mm) package.

CCB 4559 Initial Notice: Qualification of SIGN as a new assembly site for selected SST39LFxxxx and SST39VFxxxx device families available in 48L TSOP (12x20mm) package.

CCB 4560 Initial Notice: Qualification of SIGN as a new assembly site for selected SST39LF80xx, SST39VF160xx and SST39VF80xx device families available in 48L TSOP (12x20mm) package.

CCB 4564 Initial Notice: Qualification of ATK as an additional final test site for Microsemi PM8596B-FEI and PM8597B-FEI catalog part numbers (CPN) available in 436L HBFBGA (17x17x2.87mm) package.

CryptoMemory Copper (CU) Bond Wire Change

Data Sheet – 24AA01/24LC01B/24FC01 1K I2C Serial EEPROM Data Sheet

Data Sheet – 24AA02/24LC02B/24FC02 2K I2C Serial EEPROM Data Sheet Document Revision

Data Sheet – 24AA04/24LC04B/24FC04 4K I2C Serial EEPROM Data Sheet

Data Sheet – 24AA04H/24LC04BH/24FC04H 4K I2C Serial EEPROM with Half-Array Write-Protect

Data Sheet – 24AA08/24LC08B/24FC08 8K I2C Serial EEPROM Data Sheet Document Revision

Data Sheet – 24AA16/24LC16B/24FC16 Data Sheet Document Revision

Data Sheet – 24AA16H/24LC16BH/24FC16H 16K I2C Serial EERROM with Half-Array Write-Protect Data Sheet

Data Sheet – AT24C128C – I2C-Compatible (Two-Wire) Serial EEPROM 128-Kbit (16,384×8)

Data Sheet – AT24C32E – I2C-Compatible (2-Wire) Serial EEPROM 32-Kbit (4,096 x 8)

Data Sheet – AT24C32E – I2C-Compatible (2-Wire) Serial EEPROM 32-Kbit (4,096 x 8) Document Revision

Data Sheet – AT24C64D I2C-Compatible 2-Wire Serial EEPROM 64-Kbit (8,192×8) Data Sheet

Data Sheet – AT24CM02 I2C-Compatible (Two-Wire) Serial EEPROM 2-Mbit (262,144×8) Datasheet Document Revision

Data Sheet – AT24CM02 I2C-Compatible (Two-Wire) Serial EEPROM 2-Mbit (262,144×8) Document Revision

Data Sheet – AT28HC256 Industrial Grade 256-Kbit (32,768 x 8) High-Speed Parallel EEPROM Document Revision

Data Sheet – SST26VF020A 2.5V/3.0V 2-Mbit Serial Quad I/O Flash Memory

DDR3 DRAM Suppliers and Die Revisions.

Die EOL notification for SDRAM die used on Microsemi product.

DIE REVISION CHANGE NOTIFICATION

Die Revision Notification

Die revision notification.

Die Shrink for 2GB and 4GB DDR3 SDRAM Products

E Module Lead Frame Change notification

End of Life (EOL) of all wafer and package options of AT25SF081

End of Life (EOL) of all wafer and package options of AT25SF161

End of Life (EOL) of AT24C32E-UUM0B-T, AT24C16D-UUM0B-T, AT24C08D-UUM0B-T and AT24C64D-U2UM0B-T Atmel catalog part numbers (CPN)

End of Life of 208-mil SOIC packages in Green matte tin (Sn) or tin alloy for AT25SL128A, AT25QL128A, AT25SL641, AT25QL641, AT25SL321 and AT25QL321 products

End of Life of AT45DB641E WLCSP packages

End of Life of ATXP032 / ATXP128 including all wafer and package options

Engineering Change Notice for Migrating from MX25U6435E toMX25U6435F_INELTEK_20140704

EOL LFoundry Die for the AT97SC3204

EOL of A29160T (U) M SERIES

EOL of A29800T (U) M, A29801T (U) M SERIES

EOL of A29L160AT (U) M SERIES

EOL of A29L400AT (U) M SERIES

EOL of A29L800AT (U) M SERIES

eSign # E000045430: End of Life (EOL) of AT25512Y7-YH-T Atmel catalog part number (CPN).

eSign# E000042621: End of Life (EOL) AT28xx64B and AT28xx256x device families available in 28L TSOP package.

eSign# E000043226: End of Life (EOL) of AT24HC04BN-SP25-T, AT24HC04BN-SP25-B and AT24HC04B-TP25-B Atmel catalog part numbers (CPN).

Implement MMT shipping tube for selected AT27xxxx, AT28xxxx and SST39xxxx products available in 32L PLCC package

Maximum Read Frequency on Certain LSRAM Read Modes Has Been Reduced

Memolog # ML0220210049 Final Notice: Qualification of 66.88K process technology for selected Microchip products of the 24AA512, 24FC512 and 24LC512 device families.

Mercury Systems Memory End-of-Life (EOL)

Part Number Change due to Package shrinks.

Part number changes

Product Discontinuance Notice 512K X 8 BIT LOW VOLTAGE CMOS SRAM

Pyramid – EOL-20240419.1

Qualification of ATP assembly site for AT97SC3204 device family available in40L MLF (or VQFN) package.

Qualification of G600V molding compound for products available in 8L SOIC Chip-On-Lead package assembled at MTAI assembly site.

Reduction in package size and part number change.

Restart production in XFab

Spansion EOL notification of the AM29F040B, AM29F016D

UMC 8D Wafer Fabrication Facility for All AT45DB321E Products

Updating package standoff, maximum package height and lead thickness on WF2M16-XDAX5, WMF2M8-XDAX5

WC32P040-XQ4M Mechanical Dimension Change

WC32P040-XXM, Changed Figure 13 – 184 Lead, Ceramic Quad Flat

WED3C755E8MCX-XBX(-XBHX) power consumption change.

AC TIMING CHANGES FOR THE 1600Mbs 4GB DDR3 LP devices

(DE) IM Brand DRAM Module Labels Change

PRODUCT END OF LIFE (WED8L24514VxBx)

UMC 8D Wafer Fabrication Facility for All AT45DB321E Product

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