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CCB 3265.001 Final Notice: Qualification of UMC Fab 8N (U08N) as an additional fabrication site for various Atmel catalog part numbers.
CCB 3265.001 Final Notice: Qualification of UMC Fab 8N (U08N) as an additional fabrication site for various Atmel catalog part numbers.
CCB 3979 and 3979.001 Final Notice: Qualification of QMI-519 die attach material for selected products available in 28L SOIC (.300in) and 18L SOIC (.300in) packages at MTAI assembly site.
CCB 4086 and 4086.001 Final Notice: Qualification of MMT as an additional assembly site for ATA663xx, ATA656xx, ATA662xx and ATA657xx device families available in 8L VDFN (3.0×3.0x1.0mm) and 14L VDFN (3.0×4.5×0.9 mm) packages.
CCB 4179 Final Notice: Qualification of MMT as an additional assembly site for selected Atmel ATA663454 and ATA663431 device families available in 16L VDFN (3×5.5x1mm) package.
CCB 4179 Final Notice: Qualification of MMT as an additional assembly site for selected Atmel ATA663454 and ATA663431 device families available in 16L VDFN (3×5.5x1mm) package.
CCB 4179 Final Notice: Qualification of MMT as an additional assembly site for selected Atmel ATA663454 and ATA663431 device families available in 16L VDFN (3×5.5x1mm) package.
CCB 4495 Final Notice: Qualification of MTAI as a new assembly site for selected MCP25625 device family available in 28L QFN (6.0X6.0X0.9mm) package.
CCB 4495 Initial Notice: Qualification of MTAI as a new assembly site for selected MCP25625 device family available in 28L QFN (6.0X6.0X0.9mm) package.
CCB 4530 Initial Notice: Qualification of MMT as an additional assembly site for selected ATA6617C-P3QW-1 and ATA6616C-P3QW-1 catalog part numbers (CPNs) available in 38L VQFN (5x7x1mm) package.
CCB 4541 Final Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.
CCB 4569 Final Notice: Qualification of MMT as an additional assembly site for ATA6663-FAQWxx device family available in 8L VDFN (3x3x1.0mm) package.
CCB 4569 Final Notice: Qualification of MMT as an additional assembly site for ATA6663-FAQWxx device family available in 8L VQFN (3x3x1.0mm) package.
Change from conventional load board to FPGA load board at final test.
Data Sheet – ATA6571 High-Speed CAN Transceiver Datasheet Document Revision
Data Sheet – ATA663201/ATA663203/ATA663231/ATA663254 Data Sheet Document Revision
Data Sheet – High-Speed CAN Transceiver with Standby Modefor the Japanese Market
Data Sheet – MCP2518FD Data Sheet
END OF LIFE (EOL) CCE4510 24QFN,
EOL INAP125T and INAP125R
ERRATA – ATA6622C/24C/26C Errata and Data Sheet Clarifications
ERRATA – ATA6628/30 Errata and Data Sheet Clarifications Document Revision
ERRATA – ATA6663/64 Errata and Data Sheet Clarifications Document Revision
INAP395R
INOVA Semiconductors INAP5x2-5TAQ: change to a FPGA Loadboard concept AND release of ASE-CL as a second test location
PDN – INAP395R
Qualification of ANAP as an assembly site for selected products available in 64L LQFP (10x10x1.4mm) package
Qualification of ANAP assembly site for selected products available in 64L LQFP (10x10x1.4mm) package.
Qualification of ASE assembly site as an additional site for selected products available in 24L QFN (5x5x0.9mm) package.
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BCD2 Process Technology
Qualification of NSEB as an additional assembly site for selected products in 16L QFN package.
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 0.18 and0.16um GF wafer technologies
The microcode has been changed to implement guided lock for the HDMI PLL.