The SiP (System in Package) allows IoT device makers to reduce the size of their electronic circuit hence achieving a small form factor for their end products.
Based on the world’s lowest power Wi-Fi SoC DA16200, the HJ-DA16200 SiP enables the same battery life as the existing DA16200 modules but in a much smaller size (8 mm x 8 mm).
Small size is critical for many IoT applications. SiP (System in Package) allows IoT device makers to reduce the size of their electronic circuit hence achieving a small form factor for their end products. Dialog’s partner Tangshan HongJia Electronic Technology Co., Ltd. has developed an ultra-small, ultra-low power Wi-Fi SIP module with Dialog’s DA16200, the world’s most power-efficient Wi-Fi SoC. The HJ-DA16200 delivers the same long battery life and low power consumption offered by DA16200 module but in a much smaller form factor.
The fully integrated SIP consists of the DA16200 SoC, 2MB or 4MB flash memory, RF components including crystal oscillator, RF lumped filter, and an antenna. The built-in antenna is sufficient for normal application, and the external antenna can also be extended. Support customer 2-layers PCB design.
The SIP has 40 pins in 8 x 8 x 1.3mm LGA package including GPIOs, JTAG, RTC control, UART, power input and Antenna Pin (optional to use external antenna).
