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Supplier |
Description |
Date of
release |
Effective
from
|
Document |
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|
Atmel |
AT25080A and AT25160A DIE SHRINK |
04.11.2008 |
04.11.2008 |

CC084205 |
Atmel |
Automotive ATMEGA164P, ATMEGA324P, ATMEGA644P ADC Upgrade |
30.10.2008 |
30.10.2008 |

NC084202 |
Atmel |
Gold Wire Diameter Reduction for Serial Flash SOIC (.150” and .208”), and QFN/DFN Packages |
30.10.2008 |
30.10.2008 |

SC081801A |
Atmel |
AT91SAM7S32 Revision and Ordering Code Change |
10.09.2008 |
10.09.2008 |

RC083701 |
Atmel |
Change of lead-free product part number ATA5757 |
04.09.2008 |
04.09.2008 |

HC083107 |
Atmel |
Transfer of 6 and 7 mil Backgrind Operations to Atmel Philippines |
06.08.2008 |
06.08.2008 |

CC082901 |
Atmel |
Transfer of Parallel EEPROM (28 Series) Products to Pb-free & Halogenated Compound-free Green Packaging |
31.07.2008 |
31.07.2008 |

SC083106A |
Atmel |
New Sawing and Packaging Location of ATA556711N-DDT |
24.07.2008 |
24.07.2008 |

HC082803A |
| WEDC |
WF1M32B-XHX3, WF1M32B-XG2TX3
last time buy |
08.05.2007 |
08.05.2007 |

PCN0606 |